The Impact Factors of Electronic Adhesive

The electronic glue viscosity is an important performance indicator, such as the high demand of the bare chip (COB) technology to the glue cured heap and potting glue long plastic rheology requirements are the Heat Sink Paste degree requirements.



Generally, the electronic adhesive with the higher viscosity has relativly large molecular mass with good heat resistance and the initial adhesion strength is high. The products with high viscosity and low solid help to reduce the cost of product. However, in practical applications, the high viscosity of the electronic adhesive will often lead to mutual dissolution of the components in the production process more difficult, so that the rheology of the glue is poor.

Factors affecting the viscosity of the electronic glue First, it is convenient for filler in regulating electronic adhesive degree. After choosing the filler according to the performance need, you can adjust the viscosity of the adhesive through the appropriate choice of particle size and mass fraction, to meet the construction process. Second, the system viscosity obtained from the different types of the prepolymer is different, and in the precondition of satisfing the basic performance, we can make the appropriate choice of the prepolymer based on the needs of the electronic adhesive degrees with the thermal paste substitute, and by adjusting the mass fraction of the prepolymer, to meet the viscosity of the system and optimum performance requirements. Since the adjustment of the system viscosity is not very clear wehn the prepolymer mass fraction is more than 50%, therefore, in order to reduce costs, the mass fraction of the prepolymer generally will not exceed 50%.

Third, a coupling agent has the amphiphilic structure, which can improve the dispersion state of the inorganic powder in the matrix, in order to improve the rheology of the system, and an amount of 2% of the coupling agent is more appropriate. Fourth, stirring allows system mixing, uniformity of performance, and we should choose the appropriate stirring rate and mixing time, in order to meet the desired physical properties. Fifth, adhesive curing process is actually the process of e-adhesive degree change, and the mass fraction of the curing agent affects adhesive gel point balance from the system to the time (valid), so the amount of curing agent should be appropriate. We should keep these points in mind to make the better research in the electronic glue to take more shares in the market.

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Knowledge of Adhesive Sealant

Classification of Adhesive Sealant

Classification of adhesives many ways, it is not unified, commonly there are: according to chemical composition: This is a more scientific method of classification, it will be the adhesive divided into organic adhesives and inorganic adhesives. Organic adhesives are divided into synthetic adhesives and natural adhesives. Synthetic adhesive resin types have rubber type, complex type; natural adhesives such as animals, plants, minerals, natural rubber adhesive. Inorganic adhesive is divided by chemical components such as phosphates, silicates, sulfates, borates variety: Liquid adhesive and solid adhesives can be divided into morphological classification. A solution type, emulsion type, paste, film, tape, powder, granule, glue sticks. Uses: This can be divided into three main categories of structural adhesives, non-structural adhesive sealant and specialty adhesive sealant. Application methods: room temperature curing, heatset, hot melt, pressure-sensitive, and then wet-bonding agents.

Development Trend of the Adhesive Sealant

Now the non-solvent adhesive develops rapidly. The many adhesives contain a large number of highly volatile solvents, and these solvents not only endanger the physical and mental health of the people and the destruction of the ozone layer in the atmosphere. In recent years, causing the public and government attach great importance, so natural to the adhesives industry brought a new development trend, namely solvent-free adhesives development. Nano-adhesives will be the star of a dazzling new technology. Namely develops in the direction of multifunction adhesive. When a thermal paste substitute with a variety of functions at the same time when its value is often steep, so the multifunctional adhesive is one of the trends of industrial adhesives. Development of the military, defense adhesives is necessary. Development of military, defense adhesives for future war and counter-terrorism, counter-terrorism needs, so it must have developed by leaps and bounds.

Adhesives in Industrial Applications

Adhesive technology in addition to a simple, fast, efficient, inexpensive features and it can also be used to bond some other connection cannot connect or structure, such as metal and non-metal bonding, to overcome the cast iron, aluminum welding fissile and aluminum cannot be cast iron, steel welding. And can in some cases effectively replaced by welding, riveting, threaded connection, and other mechanical connections. At present, the application of the adhesive has been infiltrated into all sectors of the national economy, to become an indispensable technology in industrial production, a wide range of applications in high-tech fields, according to reports: Foreign production car to use 5 ~ 10kg adhesive; a Boeing aircraft bonding area of 2400m2; an aerospace aircraft need bonding 30000 ceramic pieces.

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