3. adapt to the high-speed machine: we must meet the feature of high-speed dispensing and high-speed of mounter, specific, high-speed dispensing without drawing Furthermore, high-speed mount, the printed circuit board in the process of transmission , the plastic patch viscous to ensure that the components do not move. 4. No drawing, no slump: Once the patch glue stick on the pad, components cannot be achieved with the electrical connection of the printed circuit board, adhesive sealant coating, no drawing and no slump avoid pollution pad. 5. Low temperature curing: curing, with wave soldering and welding well does not have to go through the reflow furnace heat-resistant cartridge components, so they requested that the hardening conditions must meet the low-temperature, short time. 6. Adjustment: reflow soldering, pre-coating process, the plastic patch is cured first before the solder is melted, the fixed component, it will hinder the components sank solder and self-adjustment. Therefore, the plastic patch should have a certain degree of self-adjustment.
There is no doubt that we should spare more time in the study of the technology of SMT adhesive to take more share of the market and capture the trend of market. And try our best to reduce the cost of the raw material.
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This article is come from:http://www.game-dice.net/the-characteristics-of-the-smt-adhesive/
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